TechInsights Unveils iPhone 8 Plus Camera Surprises
TechInsights was quick to unveil few finding from iPhone 8+ reverse engineering:
The dual rear camera uses 1.22um pixel size in 12MP wide angle sensor and 1.0um pixel is 12MP tele sensor. The 7MP front camera has 1.0um pixel size.
"The dual camera module size is 21.0 mm x 10.6 mm x 6.3 mm thick. Based on our initial X-rays it appears the wide-angle camera uses optical image stabilization (OIS), while the telephoto camera does not (the same configuration as iPhone 7 Plus).
The wide-angle Sony CIS has a die size of 6.29 mm x 5.21 mm (32.8 mm2).
This compares to a 32.3 mm2 die size for iPhone 7’s wide-angle CIS.
We do note a new Phase Pixel pattern, but the big news is the absence of surface artifacts corresponding to the through silicon via (TSV) arrays we’ve seen for a few years. A superficial review of the die photo would suggest it’s a regular back-illuminated (BSI) chip. However, we’ve confirmed it’s a stacked (Exmor RS) chip which means hybrid bonding is in use for the first time in an Apple camera!"
The dual rear camera uses 1.22um pixel size in 12MP wide angle sensor and 1.0um pixel is 12MP tele sensor. The 7MP front camera has 1.0um pixel size.
"The dual camera module size is 21.0 mm x 10.6 mm x 6.3 mm thick. Based on our initial X-rays it appears the wide-angle camera uses optical image stabilization (OIS), while the telephoto camera does not (the same configuration as iPhone 7 Plus).
The wide-angle Sony CIS has a die size of 6.29 mm x 5.21 mm (32.8 mm2).
This compares to a 32.3 mm2 die size for iPhone 7’s wide-angle CIS.
We do note a new Phase Pixel pattern, but the big news is the absence of surface artifacts corresponding to the through silicon via (TSV) arrays we’ve seen for a few years. A superficial review of the die photo would suggest it’s a regular back-illuminated (BSI) chip. However, we’ve confirmed it’s a stacked (Exmor RS) chip which means hybrid bonding is in use for the first time in an Apple camera!"
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